Power electronics technology is used in electronics to control and convert/conserve electric power. Therefore, power electronics technology can be found across multiple types of industries in devices such as inverters, converters, and rectifiers. The advances in semiconductor and power electronics manufacturing are leading toward constantly increasing power densities and heat fluxes. The smaller module sizes and higher power dissipations are challenging the existing thermal management solutions, and the traditional aluminum heat sinks are not sufficient anymore.
The current trends, such as highly integrated components, increasing voltage, current capability, and miniaturization, lead to challenges: higher power loss and higher heat dissipation density. Currently, the power levels of IGBTs are excessive for the capabilities of traditional heatsink solutions. Traditional thermal solutions such as heat sinks and heat pipes are not capable of providing enough cooling power, and therefore the performance of the VFDs suffers greatly due to high heat flux and varying environments. The alternative option is liquid cooling which increases the complexity of the design as well as the price of cooling components.
The advances in semiconductor and power electronics manufacturing are leading toward constantly increasing power densities and heat fluxes. The smaller module sizes and higher power dissipations are challenging the existing thermal management solutions, and the traditional aluminum heat sinks are not sufficient anymore.
New improved heat sink designs are needed, capable of handling higher power densities without compromising device reliability, performance, and service life.
NEOcore technology enables lighter, more reliable, and higher-performance solutions in industrial applications.
CooliBlade has developed a next-generation thermal management technology NEOcore, that offers exceptional thermal conductivity performance in a lightweight package. They enable reaching higher power levels and increased power densities even in high ambient temperatures.
NEOcore is the first integrated thermal channel realized by a pure aluminum structure where all thermal interfaces are optimized from the heat source to the air interface: The phase change principle inside of NEOcore solutions optimizes the extreme thermal connection from the heat source in the evaporator to the thermal channel which brings the heat instantly to the whole heat sink structure. The condenser area includes the application-optimized fins structures to maximize the performance of the NEOcore solution.
CooliBlade offers custom solutions for demanding industrial products, and the easiest way to start is to share the specifications of thermal management solutions with our experts. Our R&D team reviews the specifications and gives a free feasibility evaluation of the application’s technical requirements that NEOcore technology can meet. The smooth, transparent, and fast development cycle starts with prototype design.
When the prototype has passed comprehensive tests, the production unit development and production ramp-up are easy to complete quickly and professionally. Check out our development process and evaluation tool from the following link. Don’t hesitate to contact us if you need more information about NEOcore technology and how it could be used in industrial applications.
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How NEOcore revolutionizes the cooling of industrial electronics?
We compiled a brief overview about the NEOcore technology and NOVA product series in industrial electronics.
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