Blog: Maximizing the performance of novel innovative products through more efficient thermal management

Thermal management is rapidly evolving as we stand at the crossroads of next-generation innovation and digital transformation. Such emerging trends and technologies are paving the way for a smarter, efficient, and more connected world – enabling smart grid, e-mobility, renewable energy, 5G telecommunication, special electronics, and more applications. As devices become more connected, they require greater efficiency and higher performance capabilities. For instance, better thermal management facilitates maximum performance while sustaining the lifespan of next-generation products. 

This has profound implications for the broader trend of increasing the functionality of electronic systems. Thermal designers and engineers need to consider four main criteria for product development:  

  1. Optimizing the size of devices 
  2. Increased power output and performance 
  3. Cost efficiency 
  4. Robustness of product 

Attempting to satisfy these criteria creates a product development dilemma for thermal designers and engineers as conventional thermal resistance and conductivity are no longer sufficient for delivering improved device capability and design. 

Furthermore, next-generation technology runs at faster speeds and generates more heat, meaning the power density requirements of electronic component technology for many applications have increased – setting higher standards for thermal management. These electronics are used in nearly every business and product in modern industries, so a better thermal management solution is required to handle the performance efficiency, particularly in power applications.  

Thermal management needs are increasing in future products 

Thermal management is the process of monitoring and controlling the heat generated by a device or product. Thermal energy is typically extracted from heat sources and released into the ambient air. Efficient thermal management will transfer an optimal power level while maintaining a safe operating temperature for the product. If this is not done correctly, the components may be damaged. 

Thermal Management is the secret sauce in powerful products 

By the way, did you know that 55% of failures in electronic products are due to excessively high temperatures? [1] Thermal management is an important aspect of the design of electronic systems. Thermal stress is directly connected with the reliability and the lifespan of electronic equipment. Ignoring the correlations between the effects of different temperatures and other stress variables will cause performance and reliability issues. It is one primary reason why devices and installations fail or malfunction.  

Thermal management can be highly demanding in some sectors. Such as the energy sector (power inverters), industrial applications (AC Drives), or in the EV charging stations as electrification is being integrated in the automotive industry. The same is true for more complex applications, such as those found in telecommunications and radar systems.  

These electronic and telecommunications devices are increasingly used in harsh and demanding outdoor conditions. Temperatures in some parts of the world exceed 40 degrees Celsius, while temperatures in others can drop to –40 degrees Celsius, so equipment must be robust enough to withstand all types of harsh weather and environments. Places with high-temperature swings and high humidity will also cause condensation when warm air inside the enclosure meets its cold casing. Severe condensation would cause corrosion and short circuits, reducing the equipment’s lifespan. Hence, overheating is becoming a concern as electronics become more sensitive to heat and moisture. 

The problem with current thermal management solutions 

Aluminium heatsinks and heat pipes are two common thermal management solutions. A typical heatsink or heat pipe will be attached to a component or heat source to allow excess heat to dissipate into the ambient air as it passes through the structure. Liquid cooling technologies can be used in more demanding applications, but they have clear limitations regarding size and complexity. 

For example, the size and weight of the structure will grow in tandem with its capacity, resulting in bulky and heavy devices. Furthermore, it may not be mechanically possible to secure a heatsink for smaller-sized modern electronic components, because they take up too much space. Another significant challenge for designers is controlling the excess heat produced by new components, which perform more functions at faster rates. These problems result in the need for a more efficient method of removing or channelling excess heat.  

CooliBlade will ensure optimal performance for high power electronics 

We are the thermal management company that makes integrated thermal channels for power electronics companies by utilizing novel technology in our cooling products.  

CooliBlade’s NEOcore technology radically improves the thermal flow from heat source components to ambient air—optimizing the efficiency, lifespan, and weight of high-power electronics. NEOcore technology provides several benefits: 

  • Increased functionality and performance   
  • Extended the lifetime, reliability, & safety of products 
  • Reduced the product size and weight for better functionality and design space 
  • Lowered maintenance cycles and costs 

Our purpose is to facilitate the design of more effective and competitive power electronics so you can meet and overcome the demand of the ever-expanding market. 


Emily Yap,  
Business Development Manager 

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