Silicon carbide is changing power electronics. Faster switching brings higher efficiency and more power from the same module packages. On the other hand, the losses are concentrated in a much smaller area and the heat flux from this area is higher.
CooliBlade addresses this challenge through its innovative patented NEOcore thermosyphon technology, combined with expertise in simulation and design. We can design a cooling element for your SiC power module even before the actual prototype development phase begins. This ensures that the prototype will meet the most demanding performance requirements necessary for next-generation power modules.
While total losses decrease as efficiency improves, the remaining losses become concentrated within a smaller volume. Beyond a certain point, the performance of a power converter is limited by the efficiency of heat dissipation, rather than by the semiconductor component itself.
A standard off-the-shelf heat sink, selected perhaps solely based on technical specifications, may prove incapable of meeting such demanding thermal management requirements. Each unsuccessful design iteration incurs tooling costs, consumes weeks of time, and delays the finalisation of the design.
At CooliBlade, we have developed comprehensive expertise in thermal modelling. We are capable of modelling the complete thermodynamics of the passive two-phase cooling used in our NEOcore-based products, including airflow, the back pressure generated by the heat sink, and the system's interaction with your chip layout. All our models are validated by comparing them against our laboratory results. A prototype is then built and validated to confirm what has already been observed in the simulation.
The development process is very smooth and transparent. You provide us with the electronic layout of your power electronics product, the power ratings for each module, the ambient temperature, the airflow, and any space constraints. We use our latest modular solution platforms, AURORA-X or ULTIMA-X, as a starting point. This enables a rapid design cycle and a customised thermal management solution that meets even the most demanding power and environmental requirements.
Our latest-generation NEOcore-X technology transfers heat passively, without the need for a pump or a circulating coolant. In laboratory tests, the AURORA-X cooling unit, designed for narrow air duct applications, operated 24 °C cooler than a skived aluminium reference heat sink [Three SEMiX 3p+ modules, total load 4,200 W, ambient temperature 40 °C, airflow 600 m³/h].
The ULTIMA-X incorporates a large-area evaporator, allowing a single evaporator to cover multiple power modules. This enables the thermal load to be efficiently distributed across a larger evaporator surface, achieving a higher power density than is possible with conventional heat pipe solutions. This is particularly critical for applications involving high-power density SiC modules, where it is essential to spread the thermal load evenly at the very first interface directly beneath the power module.
Contact us and our experts return a free feasibility evaluation, no obligation, so you can see what the heat sink can carry before we build anything.