This post is second part (to read the first, Problems and Challenges of Power Electronics Cooling click here) of our new blog series on NEOcore, game-changing power electronics cooling technology. In the coming weeks, we’ll dive deeper into the technological innovations, unique features, and practical customer benefits of NEOcore technology. You’ll get an inside look at real-world use cases - with actual, measured results from real power electronics projects. Expect to see significant performance boosts, impressive energy savings, reduced device weight, improved end products, and even increased market share.
Stay tuned - your journey to smarter, cooler power electronics starts here!
The Growing Thermal Challenge in Power Electronics Design
In the race toward higher efficiency, greater power density, and smaller footprints, thermal management has become a decisive factor in power electronics design. Whether in renewable energy systems, electric mobility, advanced telecommunications, or industrial automation, the ability to control heat directly impacts performance, reliability, and total cost of ownership.
NEOcore™ technology from CooliBlade® addresses this challenge head-on, delivering a superior air-cooling solution that combines innovative engineering with extraordinary heat dissipation capabilities. Designed for demanding applications such as power converter cooling in solar and wind power systems, energy storage cooling, EV charging infrastructure, and industrial drives, NEOcore™ sets a new benchmark for advanced cooling solutions. NEOcore is engineered to handle heat dissipation ranging from hundreds of watts to several kilowatts per module, ensuring components operate cooler and more efficiently in high-power applications. Its revolutionary design is especially beneficial for cooling IGBT (Insulated Gate Bipolar Transistors) and SiC (Silicon Carbide) power modules, where efficient heat management is critical.
Unparalleled Thermal Conductivity
At the heart of NEOcore™ cooling technology is an integrated thermo-siphon channel built into an aluminum heat sink structure. This sealed, passive channel achieves an effective thermal conductivity of approximately 200,000 W/mK - more than 1,000 times higher than aluminum, the material typically used in heat sinks, and over 10× higher than typical heat pipes (~18,000 W/mK).
This leap in conductivity enables rapid heat transfer from high-power components, allowing IGBT and SiC modules to operate significantly cooler, even under continuous loads approaching 3 kW per power module. In customer cases NEOcore has reduced component temperatures by ~25 °C - without redesigning their system. Lower junction temperatures mean higher reliability, extended component lifespan, and the freedom to push power density further without compromising performance.
Optimized Structure for Maximum Efficiency
Every element of the NEOcore™ design is optimized for superior heat dissipation and low thermal resistance, significantly enhancing its overall performance. Key structural features include:
- Large Surface Evaporator: The heat sink incorporates a large surface evaporator that maximizes the initial heat absorption area, ensuring that heat is quickly and efficiently absorbed from the electronic components. In practice, the entire base surface of the component is utilized for optimal heat transfer directly into the NEOcore channel.
- Direct NEOcore Channel: From the evaporator, heat is rapidly transferred through the direct NEOcore channel. This direct pathway minimizes thermal resistance and accelerates heat transfer, ensuring swift and effective cooling.
- Efficient Condenser Area: In the condenser area, the vapor cools and condenses back into liquid form. The fins connected to the condenser facilitate efficient heat dissipation to the surrounding air, further enhancing the cooling process.
- Widened Air Interface in Close Proximity to the Condensation Zone: The design includes a large air interface near the condensation zone, which ensures efficient heat dissipation into the surrounding air. This feature is critical for maintaining low operating temperatures and enhancing the system's overall cooling efficiency.
This air-cooling technology combines the simplicity and maintenance-free nature of a heat sink with liquid-like cooling performance, without pumps, plumbing, or leak risks.
Key Advantages for Power Electronics Cooling
The advanced design and superior thermal properties of the NEOcore™ technology delivers measurable benefits across various power electronics applications, including renewable energy, electric vehicle charging, telecommunications and high-performance industrial applications:
- Superior Heat Dissipation: The high thermal conductivity and optimized structure ensure rapid and efficient heat dissipation, reducing the risk of overheating of power electronics applications, and thus improving device reliability.
- Reduced Thermal Interfaces: By minimizing the number of thermal interfaces, the NEOcore design reduces thermal resistance, leading to more efficient heat transfer.
- Optimized Air Interface: The large air interface in close proximity to the condensation zone ensures effective cooling, making the NEOcore cooling solutions ideal for applications where maintaining low temperatures is critical.
- Compact and Lightweight: Despite its advanced capabilities, the NEOcore heat sink remains compact and lightweight, making it suitable for a wide range of applications, from consumer electronics to industrial machinery. In customer cases, NEOcore-based cooling solution has weighted 50% less compared to tradiotional cooling solutions.
- Scalable & versatile: Adaptable for power module cooling, energy storage cooling, 5G telecom base stations, medical devices, industrial applications, LED lighting, and more.
Driving the Future of Power Electronics Cooling Innovation
As power electronics become more compact, powerful, and mission-critical, the need for cost-efficient, high-performance cooling solutions will continue to rise. NEOcore technology represents a significant leap forward in thermal management solutions, particularly for high-power electronics, such as IGBT and SiC modules, which require efficient heat dissipation in the range of hundreds of watts to 3 kW per module. Its exceptional thermal conductivity, optimized design, and numerous advantages make it a game-changer in the power electronics industry.
NEOcore™ technology positions CooliBlade® at the forefront of thermal management innovation, offering power electronics engineers and system designers a proven path to increase reliability, reduce weight, and improve total system efficiency. From solar inverters and wind turbine converters to electric vehicle powertrains, industrial motor drives, and special electronics such as military, laser, and medical systems — NEOcore™ delivers the performance modern applications demand, without the complexity and costs of liquid cooling.
Stay tuned for the next part of NEOcore series as we dive deeper into the innovations and real-world results of NEOcore technology. We’ll explore more technological breakthroughs, features, benefits, and customer success stories.
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