Groundbreaking cooling platforms
for the most demanding applications
A flexible ultra light 3D heat sink for semiconductor and power components
An extremely cost-efficient heat sink for high-power semiconductor modules
Ultimate performance for the most demanding power modules.
High power electronics applications from tens of watts to several kilowatts
Redefining the thermal management design process
Thermal management solutions typically need customization. We customize the optimal cooling solution for your product. Our process goes from rapid prototyping to mass production even in less than 6 months thanks to our ready-to-go technology platforms.
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CooliBlade offers extremely efficient cooling solution for high power electronics.
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Thermal Channel Technologies Oy
Palolantie 3E, 90620 Oulu, Finland
+358 40 353 6580
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