CooliBlade, the Finnish thermal management company behind the patented NEOcore thermosyphon technology, today announced the launch of two next-generation air-cooling products: ULTIMA-X and AURORA-X. Both products make their public debut at PCIM Europe 2026 in Nuremberg, Germany.
The X series represents the most significant advancement in CooliBlade's product line to date, introducing the NEOcore-X evaporator, a refined two-phase cooling architecture that sets a new performance ceiling for passive air cooling in power electronics.
Why It Matters
SiC power modules now routinely dissipate 1–3 kW in compact form factors, pushing conventional aluminium heat sinks beyond their operational limits. Liquid cooling can manage the thermal load, but at the cost of pumps, coolant circuits, maintenance overhead, and leak risk.
ULTIMA-X and AURORA-X offer a third path: passive air cooling that closes the performance gap with liquid, with none of the mechanical complexity.
ULTIMA-X
ULTIMA-X is CooliBlade's high-density thermosyphon platform for IGBT and SiC module applications. Its defining feature is an expanded baseplate architecture: a single unit now covers multiple power modules simultaneously, enabling higher power density without a larger system footprint.
Key performance data (initial simulated performance, LV100 @ 40°C ambient):
- Up to 27°C cooler than skived aluminium at 2,200 W
- Up to 52°C cooler than extruded aluminium at 2,200 W
- Up to 50% thermal performance improvement vs. extruded aluminium
ULTIMA-X supports free-form heat sink geometry, allowing designers to work around complex enclosures and irregular module layouts. It is a drop-in upgrade for existing ULTIMA installations with no envelope change required.
Applications: AC drives, EV charging infrastructure, BESS and renewable energy inverters, data centers, UPS power sources.
Read more on the ULTIMA-X product page.
AURORA-X
AURORA-X is CooliBlade's thermosyphon platform for narrow air duct, height-constrained applications. The NEOcore-X evaporator introduces omnidirectional 2D heat spreading: heat is distributed horizontally and vertically across the full baseplate the instant it leaves the module surface, eliminating hot spots before they form.
Key performance data (initial simulated performance, LV100 @ 40°C ambient):
- Up to 19°C cooler than skived aluminium at 2,200 W
- Up to 44°C cooler than extruded aluminium at 2,200 W
- Up to 40% thermal performance improvement vs. extruded aluminium
AURORA-X is a direct drop-in replacement for high-density skived or extruded aluminium heat sinks. Fins are alignable to any airflow direction with no mechanical redesign required.
Applications: EV charging stations, AC drives, solar converters, BESS inverters, lifts, telecommunications, UPS power sources.
Read more on the AURORA-X product page.
NEOcore-X: The Technology Inside
Both products are powered by NEOcore-X, an evolution of CooliBlade's core patented thermosyphon technology. NEOcore is a fully passive, fully integrated two-phase system built entirely in aluminium — no pumps, no coolant circuits, no copper-aluminium interfaces, no corrosion risk.
Heat from the power module enters a large integrated evaporator spanning the full baseplate. The working fluid vaporises at the source, rises through sealed condenser channels to the air interface, releases heat to the airstream, and returns by gravity. The system operates continuously and silently with no external energy input.
NEOcore-X introduces a refined evaporator geometry that further reduces thermal resistance at the source, delivering lower junction temperatures at identical airflow — or equivalent temperatures at reduced airflow and footprint.
Pilot Partnerships Now Open
Both ULTIMA-X and AURORA-X are in final validation. CooliBlade is accepting a limited number of pilot partners to validate the products in real application environments.
Interested companies can request a free feasibility study, in which CooliBlade simulates the specific geometry and load case using the same validated models behind the published performance data.